DICING SAW

      MRS-DT/DS series dicing system includes full automatic dicing saw (twin spindle) and semi-auto dicing saw (single spindle), can be widely used in various wafers, ceramics, silicon wafers, glass and lithium niobate, also compatible with products of QFN, DFN and PCB in package sawing process, DFN and PCB and has accurate positioning of high-definition images, automatic kerf check detection, blade breakage detection (BBD), NCS non-contact height measurement, cleaning, UV and other functions.

      Danh mục:

      Fully Automatic Dicing Saw: 8-inch & 12-inch

      Semi-automatic Single-spindle Dicing Saw: 8-inch & 12-inch

      Semi-automatic Single-spindle Dicing Saw: 4-inch & 6-inch

      Product Advantages

      • Comply with international standards, high-precision design.
      • Mainstream 8-inch & 12-inch ceramic table.
      • Friendly user interface.
      • UPH: High throughput.
      • NCS: Non contact setup.
      • Flexible customization.

      Main Configuration

      • Mainstream 8-inch & 12-inch ceramic table.
      • Image recognition function, automatic alignment.
      • Blade breakage detection (BBD) function.
      • NCs: Non contact setup.
      • Kerf check function, multi-work cutting selection system.

      DICING TOTAL SOLUTION

      • MRS-UV can used in UV-Tape degumming after cutting, assembly with chamber box structure, and touch panel, easy operation.
      • MRC-ACS can be widely used in water, QFN, Glass, PCB, smart phone module and ceramic, ect. MRS-ACS can provide two stream nozzle cleaning solution. With programmable controller plus full-color touch panel as the control system, the performance of the whole machine is more stable and the operationis more convenient.
      • MRS-AWM can be used in mounting for wafer, QFN, Glass, PCB, ect. Auto tape mounting without bubble and crack.

      Đánh giá

      Chưa có đánh giá nào.

      Hãy là người đầu tiên nhận xét “DICING SAW”