SIC LASER DICING MACHINE

      MRS-ST series wafer laser dicing system for SiC, based on silicon carbibe substrate, adopts ultra-fast laser precision micro-dicing process, which is a high-precision and high-efficiency laser dicing equipment. Customized laser systems are suitable to dice various transparent and brittle materials, e.g. silicon, carbibe, sapphire, silicon, glass and other materials, was widely used in semiconductor wafers (SiC), LED, waffers(sapphire), IR  filters (glass), etc.
      Danh mục:
      Product Advantage
      • Fully automatic and compatible 4/6 inch sheet in production.
      • Picosecond laser is specially designed for SiC material, make stable dicing effect.
      • With FDC automatic focus following system. Real-time adjustment of dicing. position. High precision, compatible with thickness diviation of ± 15μm.
      • IR camera, with function of automatic focus, horizonal alignment, ect.
      • Professional design of shock absorption, strong seismic resistance and high machine stability.
      • Small footprint save space.

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